As microprocessors have shrunk, the wiring between them hasn't always kept up. But engineers at the University of Illinois are changing that with a decades-old metalworking technique.
Yu noted that the amount of processor power needed on chips is growing. That means the wires have to be thinner and smaller, and sometimes have to be constructed in three-dimensional space.
Yu and a graduate student, Jie Hu, realized that water is easy to shape, and at small scales the surface tension is quite strong. The phenomenon is easy to see when tiny droplets of water stretch between small objects.